Categories: (M.2 Cards, Wi-Fi, HP SDIO)

EVIA M.2 2230 SDIO

High performance Wi-Fi module supporting 802.11 a/b/g/n/ac MU-MIMO

  • Supports SDIO host interface with high data throughputs
  • FCC, IC, CE certified
  • Enterprise level security 802.1x and advanced encryption protocols WPA/WPA2
  • Highly integrated module with tuned RF for high performance and long range

EVIA M.2 2230 SDIO card is a high performance Wi-Fi certified wireless card supporting dual-band 1-stream (1T1R) Wi-Fi 802.11 a/b/g/n/ac M.2 2230 form factor. This small form-factor card provides superior throughput and long range by integrating high performance baseband, MAC, fine-tuned RF front end, power amplifiers, filters, switches, diplexer and needed crystals.This card delivers low-latency and high performance Wi-Fi for superior user experience. This card enables low-power designs by utilizing multiple advanced power-saving techniques including wake on wireless and many host off-loading features. EVIA M.2 2230 SDIO is based on Qualcomm QCA9377 SoC and connects to host processor with SDIO 3.0 (Wi-Fi) host interface. These cards are offered with antenna diversity in Industrial and commercial temperature grades. They are certified for FCC, IC, and ETSI/CE. Approval for other countries may be possible upon request.

The EVIA M.2 2230 SDIO card is a platform that enables evaluation of hosted Wi-Fi, Bluetooth connectivity. It uses a SDIO interface for Wi-Fi over M.2 connector. The card includes procedure for Linux build and instructions set, scripts to test the following:

  • Wi-Fi Wireless Functionality
  • Concurrent mode
  • Wi-Fi Security modes
  • Throughputs


EVIA M.2 2230 SDIO card


Linux kernel build for x86, embedded platforms


Wi-Fi features

  • Industry proven best performing Wi-Fi Technology supporting low power dual-band (2.4 and 5 GHz), 1-stream MU-MIMO 802.11ac
  • Offers advanced security features: WPA/WPA2 Personal and Enterprise, WPS 2.0
  • WLAN Encryption : WEP, TKIP, AES
  • Operating modes :
    • STA and SoftAP
    • P2P Group Owner, P2P Client
    • STA + SoftAP, STA + P2P Group Owner, STA + P2P Client, Support for multiple BSSID (Two softAPs and a STA can operate concurrently)
  • Module Power save : Deep sleep mode, protocol power save modes – Legacy, UAPSD and Tx power saving feature : GreenTx
  • Host Power save : Wake-on-Wireless, ARP offloading to firmware
  • Transmit beamforming
  • QoS/WMM and WMM-PS
  • DFS Client and Master
  • Roaming : 11r/FT, Legacy fast roaming
  • 802.11ai : FILS-SK in STA mode
  • Host interfaces : SDIO 3.0 for Wi-Fi
  • Globally certified module
  • Package: 2230 M.2 LGA
  • Industrial temperature grade
WLAN Technology 802.11 a/b/g/n, 1-stream MU-MIMO 802.11ac
Frequency band 2.4 GHz, 5 GHz
On air data rates 2.4 GHz

  • 11b – 1, 2, 5.5, 11Mbps
  • 11g – 6, 9, 12, 18, 24, 36, 48, 54 Mbps
  • 11n – MCS0 to MCS7 or Up to 150 Mbps

5 GHz

  • 11a – 6, 9, 12, 18, 24, 36, 48, 54 Mbps
  • 11n/ac – MCS0 to MCS9 or Up to 433 Mbps
Security features WPA/WPA2 -PSK TKIP/AES, WPS 2.0, Enterprise Security (EAP) STA only
Modulation schemes 2.4 GHz

  • 11b – BPSK, QPSK, CCK
  • 11g – BPSK, QPSK, 16-QAM, 64-QAM
  • 11n – PSK, QPSK, 16-QAM, 64-QAM

5 GHz

  • 11n/ac – BPSK, QPSK, 16-QAM, 64-QAM
Antenna options Antenna Diversity with 2 x MHF4
Host interface Wi-Fi – SDIO 3.0
Max throughput 310 Mbps
Maximum Transmit Power 18 dBm
Receive Sensitivity -97.5dBm
WLAN bandwidths 20/40/80MHz
Power supply 3.3v
Operating Temperature -400C to 850C
Humidity 5-90% non condensing
Package 22mm x 30mm x 1.5mm M.2 LGA
Certifications and approvals FCC, IC, CE, TELEC
Product Brief
560 KB
Quick Start Guide
620 KB
EVK User Guide
2.5 MB
Request For Download
Data Sheet
2 MB
Request For Download

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Part No Protocol Architecture Dimensions
(L x W x H) in mm
Package Antenna Description
I950HC00-I63T 802.11 ac/a/b/g/n Hosted 22 x 30 x 1.5 M.2 LGA MHF4 Card for Wi-Fi development Buy
204281-1100 802.11 ac/a/b/g/n Hosted 22 x 30 x 1.5 M.2 LGA MHF4 Antenna for EVIA M.2 2230 SDIO card Buy

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